| Specification | ProcessDescription | Category | SpecLimits |
| AMS 2404 | Plating, Electroless Nickel | Chemical Processing | Limits: Mid-high level phosphorous only. |
| AMS 2418 | Copper Plating (Electrodeposited) | Chemical Processing | Limits: None |
| AMS-P-81728 | Plating, Tin-Lead (Electrodeposited) | Chemical Processing | Limits: None |
| AMS-QQ-N-290 | Nickel Plating (Electrodeposited) | Chemical Processing | Limits: None |
| ASTM B488 | Electrodeposited Coatings of Gold for Engineering Uses | Chemical Processing | Limits: None |
| MIL-C-14550 | Copper Plating -(Electrodeposited) | Chemical Processing | Limits: None |
| MIL-C-26074 | Plating - Nickel - Electroless | Chemical Processing | Limits: Mid-high level phosphorous only. |
| MIL-DTL-14538 | Chromium Plating, Black (Electrodeposited) | Chemical Processing | Limits: None |
| MIL-DTL-45204 | Electrodeposited Gold Plating | Chemical Processing | Limits: None |
| MIL-DTL-5541 | Chemical Conversion Coatings for Aluminum and Aluminum Alloy | Chemical Processing | Limits: Class 1A only |
| PR6-49 | CHROMIUM PLATING, BLACK, ELECTRODEPOSITED | Space | Limits: Optical absorption must be performed by buyer. |