| Specification | ProcessDescription | Category | SpecLimits |
| M273876 | DESTRUCTIVE PHYSICAL ANALYSIS (DPA), REQUIREMENTS FOR | Miscellaneous | Limits: None |
| MIL-STD-1580 | DESTRUCTIVE PHYSICAL ANALYSIS (DPA) FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL | Materials Testing | Limits: None |
| MIL-STD-202 (Method 209) | Radiographic Inspection of Electronic Components | Limits: Digital X-Ray | |
| MIL-STD-750 (Method 1071) | Hermetic Seal Leak Test for Semiconductor Devices | Limits: None | |
| MIL-STD-883 | Test Method Standard Microcircuits | Materials Testing | Limits: None |
| MIL-STD-883 (Method 2012) | Radiographic Inspection of Electronic Components | Limits: Digital X-Ray | |
| TS19-03 | Radiographic Inspection of Electronic Components | Space | Limits: Digital X-Ray |
| TS19-03/01 | RADIOGRAPHIC INSPECTION CRITERIA RESISTORS, DETAIL SPECIFICATION SHEET | Space | Limits: None |
| TS19-03/05 | RADIOGRAPHIC INSPECTION CRITERIA MONOLITHIC AND HYBRID MICROCIRCUTES, DETAIL SPECIFICATION SHEET | Space | Limits: None |