| Specification | ProcessDescription | Category | SpecLimits |
| AMS 2404 | Plating, Electroless Nickel | Chemical Processing | Limits: None |
| AMS 2418 | Copper Plating (Electrodeposited) | Chemical Processing | Limits: Type 1 only |
| AMS-C-26074 | Plating - Nickel - Electroless | Chemical Processing | Limits: Mid Phos (5 - 9% by Weight) |
| AMS-P-81728 | Plating, Tin-Lead (Electrodeposited) | Chemical Processing | Limits: None |
| AMS-QQ-N-290 | Nickel Plating (Electrodeposited) | Chemical Processing | Limits: Class 1 only |
| ASTM B700 | Standard Spec for Electrodeposited Coatings of Silver for Engineering Use | Chemical Processing | Limits: Grades A & D Only |
| ASTM B733 | Standard Specification for Autocatalytic (Electroless) Nickel-Phosphorus Coatings on Metal | Chemical Processing | Limits: Type 1, Type IV and Type V, Class 1, 2, 3, 4 and 5 |
| MIL-C-14550 | Copper Plating -(Electrodeposited) | Chemical Processing | Limits: Class 0 to 4 |
| MIL-C-26074 | Plating - Nickel - Electroless | Chemical Processing | Limits: Mid Phos (5 - 9% by Weight) |
| MIL-P-81728 | Plating - Tin Lead (Electrodeposited) | Chemical Processing | Limits: None |
| PR6-33 | Copper Plating | Space | Limits: None |
| PR6-5 | Electrodeposited Solder Coating | Space | Limits: Bend test per ASTM B571 using 4T mandre |
| QQ-N-290 | Nickel Plating (Electrodeposited) | Chemical Processing | Limits: Class 1 only |
| QQ-S-365 | Silver Plating, Electrodeposited, General Requirements for | Chemical Processing | Limits: Type 1 & 2, Grade A, B & D, Class N & S |