| Specification | ProcessDescription | Category | SpecLimits |
| M273876 | DESTRUCTIVE PHYSICAL ANALYSIS (DPA), REQUIREMENTS FOR | Miscellaneous | Limits: None |
| M273876/01 | Destructive Physical Analysis (DPA), Requirements for Diodes | Limits: None | |
| M273876/02 | Destructive Physical Analysis (DPA), Requirements for Transistors | Limits: None | |
| M273876/03 | Destructive Physical Analysis (DPA), Requirements for Microcircuits | Limits: None | |
| M273876/04 | Destructive Physical Analysis (DPA), Requirements for Hybrids | Limits: None | |
| M273876/20 | Destructive Physical Analysis (DPA), Requirements for Quartz Crystal Units, Monolithic Crystal Filters and Hybrid Type Crystal Oscillators | Limits: None | |
| M273876/22 | Destructive Physical Analysis (DPA), Requirements for Microcircuits/Hybrids, MMIC, GaAs | Limits: None | |
| MIL-STD-1580 | DESTRUCTIVE PHYSICAL ANALYSIS (DPA) FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL | Materials Testing | Limits: None |
| MIL-STD-750 (Method 1071) | Hermetic Seal Leak Test for Semiconductor Devices | Limits: None | |
| MIL-STD-883 | Test Method Standard Microcircuits | Materials Testing | Limits: Method 1018.10 |