| Specification | ProcessDescription | Category | SpecLimits |
| AMS 2418 | Copper Plating (Electrodeposited) | Chemical Processing | Limits: None |
| AMS-C-26074 | Plating - Nickel - Electroless | Chemical Processing | Limits: None |
| AMS-QQ-N-290 | Nickel Plating (Electrodeposited) | Chemical Processing | Limits: None |
| ASTM B488 | Electrodeposited Coatings of Gold for Engineering Uses | Chemical Processing | Limits: None |
| ASTM B700 | Standard Spec for Electrodeposited Coatings of Silver for Engineering Use | Chemical Processing | Limits: None |
| ASTM B733 | Standard Specification for Autocatalytic (Electroless) Nickel-Phosphorus Coatings on Metal | Chemical Processing | Limits: None |
| MIL-C-14550 | Copper Plating -(Electrodeposited) | Chemical Processing | Limits: None |
| MIL-C-26074 | Plating - Nickel - Electroless | Chemical Processing | Limits: None |
| MIL-DTL-45204 | Electrodeposited Gold Plating | Chemical Processing | Limits: None |
| PR6-33 | Copper Plating | Space | Limits: None |